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Case Studies

SoftJin has successfully delivered customized EDA and Desgin services to electronic design companies across the globe. The case studies below will give you a glimpse of how we engage with customers, understand their requirements and develop customized software that exactly solves the problem they are faced with across the various EDA domains.

System Development System Software and Hardware Development for IC Packaging Equipment » We developed the complete data processing system for a mask less exposure system used in PCB and IC package manufacturing. The software used multi-threaded architecture and the hardware is implemented on an FPGA platform. System Design Automation System C based Co-simulation environment » We developed a System C based co-simulation environment and Qt based interactive Graphical Debugger for PACT XPP Technologies, a dataflow type re-configurable parallel processor vendor. Logic Design Automation HDL Front End » We developed a HDL Front End for the internal use of a large Japanese semiconductor company. Enabling RTL-to-Gate Equivalence Checking » Fujitsu Labs of America [FLA] accelerated its product development plans by outsourcing development of a key component of its Equivalence Checking product to SoftJin. [Click here to learn about the re-used SoftJin EDA component in this project.] Physical Design Automation Semi-Automatic In-Place Optimization » We engaged with a large system house in Japan to deliver customized tools for the back-end design flow. [Click here to learn about the re-used SoftJin EDA component in this project.] Cell characterization Tool » We developed cell characterization tools for a North American telecom giant that matched the exact procedure being used by the library developers. Test, Assembly and Manufacturing Fast Photo-mask Generation » We delivered on the challenge of developing a fast photo-mask generation tool with an unmatched feature set. System software for IC Packaging Equipment » SoftJin developed key software components that drive a Maskless Exposure System for IC Package manufacturing.